US Patent Issued to NITTO DENKO on Sept. 15 for "Wiring circuit board having a conductive layer with a via portion" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,739,981, issued on Sept. 15, was assigned to NITTO DENKO Corp. (Osaka, Japan).

"Wiring circuit board having a conductive layer with a via portion" was invented by Takahiro Ikeda (Osaka, Japan) and Teppei Niino (Osaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring circuit board includes a metal support board, a first metal thin film, an insulating layer, a second metal thin film, and a conductive layer in a thickness direction order. The insulating layer includes a through hole penetrating in the thickness direction, which includes a first opening end at the first metal thin film side, a second opening end opposite to the first opening e...