US Patent Issued to NITTO DENKO on Oct. 27 for "Optical element bonding/reinforcing resin composition, and optical module produced by using the same" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,775,142, issued on Oct. 27, was assigned to NITTO DENKO Corp. (Ibaraki, Japan).

"Optical element bonding/reinforcing resin composition, and optical module produced by using the same" was invented by Kazuaki Suzuki (Ibaraki, Japan), Naoto Konegawa (Ibaraki, Japan), Atsushi Yamagishi (Ibaraki, Japan) and Tadao Okawa (Ibaraki, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An optical module in which a space between a light emitting portion (or a light receiving portion) (11a) of an optical element (11) and an insulating layer (1) of an electric circuit board (E) is filled with a cured product of a light-transmissive resin composition containing a cur...