US Patent Issued to NITTO DENKO on Oct. 14 for "Electrical debonding adhesive sheet, joined body, and joining and separation method for adherend" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,441,083, issued on Oct. 14, was assigned to NITTO DENKO Corp. (Ibaraki, Japan).

"Electrical debonding adhesive sheet, joined body, and joining and separation method for adherend" was invented by Kaori Akamatsu (Ibaraki, Japan), Kaori Mizobata (Ibaraki, Japan), Ryo Awane (Ibaraki, Japan), Akira Hirao (Ibaraki, Japan), Junji Yokoyama (Ibaraki, Japan) and Yosuke Shimizu (Ibaraki, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention provides an electrical debonding type adhesive sheet capable of producing a joined body in which a voltage can be stably applied to an electrical debonding type adhesive layer. An electrical debonding type ...