US Patent Issued to NITTO DENKO on Jan. 20 for "Wiring circuit board assembly sheet and method for producing wiring circuit board assembly sheet" (Japanese Inventor)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,417, issued on Jan. 20, was assigned to NITTO DENKO Corp. (Osaka, Japan).

"Wiring circuit board assembly sheet and method for producing wiring circuit board assembly sheet" was invented by Naoki Shibata (Osaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An assembly sheet as a wiring circuit board assembly sheet includes a substrate, a wiring pattern, and a dummy wiring pattern. The substrate includes a product region and a frame region adjacent to the product region. The wiring pattern is located on one side in a thickness direction of the substrate in the product region, and includes a first wiring and a second wiring thicker than the fir...