ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,563,675, issued on Feb. 24, was assigned to NITTO DENKO Corp. (Osaka, Japan).
"Wiring circuit board assembly sheet" was invented by Rihito Fukushima (Osaka, Japan), Takahiro Ikeda (Osaka, Japan) and Shun Shiga (Osaka, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring circuit board assembly sheet includes a wiring circuit board including a conductive pattern and a frame including a dummy conductive pattern. The frame includes a dummy formation region. The dummy formation region includes the dummy conductive pattern. The dummy formation region has a width of 5 mm from an edge of the wiring circuit board and a length identical to that of the wi...