US Patent Issued to NITTO DENKO on Dec. 23 for "Wiring circuit board and producing method thereof" (Japanese Inventors)

ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,507,341, issued on Dec. 23, was assigned to NITTO DENKO Corp. (Osaka, Japan).

"Wiring circuit board and producing method thereof" was invented by Rihito Fukushima (Osaka, Japan) and Shusaku Shibata (Osaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring circuit board includes a base insulating layer, a first wiring layer disposed at one side in a thickness direction of the base insulating layer, and a cover insulating layer disposed on one surface in the thickness direction of the base insulating layer so as to cover the first wiring layer. The first wiring layer includes a first wiring portion in contact with one surface of the base insul...