ALEXANDRIA, Va., July 16 -- United States Patent no. 12,667,900, issued on June 30, was assigned to Niterra Materials Co. Ltd. (Yokohama, Japan).
"Method for manufacturing ceramic circuit board" was invented by Akito Sasaki (Yokohama, Japan), Hiromasa Kato (Nagareyama, Japan) and Hideaki Hirabayashi (Yokohama, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "According to the embodiment, in a method for manufacturing a ceramic circuit board in which a copper plate is bonded to at least one surface of a ceramic substrate via a brazing material layer, the brazing material layer does not include Ag, but includes Cu, Ti, and one or two of Sn or In, and a ceramic circuit board is prepared in which a portion of...