US Patent Issued to Niterra Materials on Feb. 24 for "Tungsten wire, and tungsten wire processing method and electrolytic wire using the same" (Japanese Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,559,823, issued on Feb. 24, was assigned to Niterra Materials Co. Ltd. (Yokohama, Japan).

"Tungsten wire, and tungsten wire processing method and electrolytic wire using the same" was invented by Hitoshi Aoyama (Yokohama, Japan), Hideaki Baba (Yokohama, Japan), Masanori Mizobe (Yokohama, Japan) and Kenji Tomokiyo (Yokohama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "According to one embodiment, a tungsten wire includes a tungsten alloy containing rhenium. The tungsten wire includes a protrusion peak density (Spd) of 7000 or more and 11000 or less as a surface roughness parameter."

The patent was filed on Oct. 24, 2023, under Application No. 1...