US Patent Issued to NISSAN MOTOR on April 7 for "Heat conduction film and heat-dissipating structure using same" (Japanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,595,979, issued on April 7, was assigned to NISSAN MOTOR Co. LTD. (Yokohama, Japan).

"Heat conduction film and heat-dissipating structure using same" was invented by Tetsuro Naito (Kanagawa, Japan), Yoshiko Tsukada (Kanagawa, Japan), Takako Kaneko (Kanagawa, Japan), Atsuhiko Yajima (Kanagawa, Japan) and Kazuyuki Shiratori (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a means capable of selectively improving thermal conductivity in a surface direction of a heat conduction sheet.A heat conduction film is configured by disposing a scale-like carbon material formed of a plurality of graphene layers and a binder such that adjace...