ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,559,655, issued on Feb. 24, was assigned to NISSAN CHEMICAL Corp. (Tokyo).
"Polysiloxane-containing temporary adhesive comprising heat-resistant polymerization inhibitor" was invented by Kazuhiro Sawada (Toyama, Japan), Shunsuke Moriya (Toyama, Japan), Tetsuya Shinjo (Toyama, Japan), Hiroshi Ogino (Toyama, Japan) and Takahisa Okuno (Toyama, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A temporary adhesive without the formation of voids between a support and a wafer. A temporary adhesive for separatably attaching a support to a circuit side of a wafer to process a rear surface of the wafer, the temporary adhesive including a component (A) that is...