US Patent Issued to NIPPON MICROMETAL, NIPPON STEEL Chemical & Material on Nov. 3 for "AI wiring material" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,781,313, issued on Nov. 3, was assigned to NIPPON MICROMETAL Corp. (Saitama, Japan) and NIPPON STEEL Chemical & Material Co. Ltd. (Tokyo).

"AI wiring material" was invented by Tomohiro Uno (Tokyo), Yuya Suto (Tokyo), Tetsuya Oyamada (Tokyo), Daizo Oda (Saitama, Japan), Yuto Kurihara (Saitama, Japan) and Motoki Eto (Saitama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided an Al wiring material which can achieve sufficient bond reliability of bonded parts in a high-temperature environment at the time when a semiconductor device operates. The Al wiring material containing one or more of Pd and Pt so as to satisfy3less than equal tox1a...