US Patent Issued to NIPPON MICROMETAL, NIPPON STEEL Chemical & Material on March 17 for "Bonding wire for semiconductor devices" (Japanese Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,982, issued on March 17, was assigned to NIPPON MICROMETAL Corp. (Saitama, Japan) and NIPPON STEEL Chemical & Material Co. Ltd. (Tokyo).

"Bonding wire for semiconductor devices" was invented by Motoki Eto (Saitama, Japan), Daizo Oda (Saitama, Japan), Tomohiro Uno (Tokyo) and Tetsuya Oyamada (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a bonding wire for semiconductor devices that exhibits a favorable bondability even when being applied to wedge bonding at the room temperature, and also achieves an excellent bond reliability. The bonding wire includes a core material of Cu or Cu alloy (hereinafter referred to as a "Cu core...