US Patent Issued to NINGBO INSTITUTE OF MATERIALS TECHNOLOGY AND ENGINEERING, CHINESE ACADEMY OF SCIENCES on June 30 for "Supramolecular hot melt adhesive and preparation method thereof" (Chinese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,668,722, issued on June 30, was assigned to NINGBO INSTITUTE OF MATERIALS TECHNOLOGY AND ENGINEERING, CHINESE ACADEMY OF SCIENCES (Ningbo, China).

"Supramolecular hot melt adhesive and preparation method thereof" was invented by Haiming Chen (Ningbo, China) and Dongsheng Mao (Ningbo, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention provides a supramolecular hot melt adhesive. The present application also provides a method for preparing a supramolecular hot melt adhesive, comprising the steps of: A) dissolving a diol oligomer or diamine oligomer in a solvent, and reacting the mixture with diisocyanate under the action of a catal...