US Patent Issued to NIDEC COMPONENTS on May 26 for "Electronic component housing" (Japanese Inventor)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,638,315, issued on May 26, was assigned to NIDEC COMPONENTS Corp. (Tokyo).

"Electronic component housing" was invented by Kazuto Ohtake (Sano, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A casing is capable of preventing loosening of screws. A first attachment part of a first casing is fixed to a third surface of a block using a first screw. A second attachment part of a second casing is fixed to a fourth surface of the block using a second screw. Both upper surfaces of the first and the second casing are fixed using a third screw. The first and second screws are arranged on each side in a direction intersecting a longitudinal direction of the f...