US Patent Issued to NIDEC CHAUN-CHOUNG TECHNOLOGY on Oct. 27 for "Three-dimensional loop-type heat exchanging device" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,774,857, issued on Oct. 27, was assigned to NIDEC CHAUN-CHOUNG TECHNOLOGY Corp. (New Taipei City, Taiwan).

"Three-dimensional loop-type heat exchanging device" was invented by Hsien-Wen Kuo (New Taipei City, Taiwan), Shih-An Yang (New Taipei City, Taiwan), Huang-Ming Chiu (New Taipei City, Taiwan), Yu Han (New Taipei City, Taiwan) and Cheng-Han Jheng (New Taipei City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A three-dimensional loop-type heat exchanging device includes a vapor chamber and at least one loop heat pipe. The vapor chamber has a bottom plate and a cover plate that together enclose an accommodating space. The cover plate has at l...