US Patent Issued to NICHIA on May 26 for "Method for manufacturing light emitting device, bonding method, and light emitting device" (Japanese Inventor)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,640,534, issued on May 26, was assigned to NICHIA Corp. (Anan, Japan).

"Method for manufacturing light emitting device, bonding method, and light emitting device" was invented by Ryota Okuno (Tokushima, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing a light emitting device includes: disposing a light emitting element on a base member; providing a bonding agent to the base member or a lid member; and bonding the base member on which the light emitting element is disposed and the lid member with the bonding agent by sandwiching the bonding agent in a molten state between the base member and the lid member, and pressing the ...