US Patent Issued to NICHIA on April 7 for "Wiring board, light emitting device, and method for manufacturing thereof" (Japanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,705, issued on April 7, was assigned to NICHIA Corp. (Anan, Japan).

"Wiring board, light emitting device, and method for manufacturing thereof" was invented by Masaaki Katsumata (Anan, Japan), Takashi Kuraoka (Anan, Japan) and Eiko Minato (Anan, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing a wiring board that includes preparing a substrate including an insulating resin and a metal member having an anti-rust layer formed on a surface thereof that is arranged so as to face a second surface of the insulating resin. The method includes forming a bottomed hole by irradiating a first laser beam from a first surface side ...