US Patent Issued to NGK INSULATORS on March 17 for "Cooling plate and member for semiconductor manufacturing apparatus" (Japanese Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,904, issued on March 17, was assigned to NGK INSULATORS Ltd. (Nagoya, Japan).

"Cooling plate and member for semiconductor manufacturing apparatus" was invented by Masato Misaki (Handa City, Japan), Koichi Yoshino (Nagoya City, Japan), Akiyoshi Hattori (Nagoya City, Japan) and Kazuhiro Nobori (Handa City, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A cooling plate according to the present invention contains 42% to 65% by mass of TiSi2, 4% to 16% by mass of TiC, and a smaller amount of SiC than the mass percentage of TiSi2."

The patent was filed on Feb. 23, 2023, under Application No. 18/173,208.

*For further information, including images,...