US Patent Issued to NGK INSULATORS on July 14 for "Bonded substrate" (Japanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,679,778, issued on July 14, was assigned to NGK INSULATORS Ltd. (Nagoya, Japan).

"Bonded substrate" was invented by Takashi Ebigase (Nagoya, Japan) and Izumi Masuda (Kitanagoya, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Electrical insulating properties between adjacent copper plates are improved while a defect of a bonded substrate which is caused by concentration of stress to end portions of the copper plates is prevented. A bonded substrate includes a silicon nitride ceramic substrate, a copper plate, and a bonding layer. The copper plate and the bonding layer are disposed on the silicon nitride ceramic substrate. The bonding layer bonds th...