US Patent Issued to NEXTRONICS ENGINEERING, MAKALOT INDUSTRIAL on Sept. 15 for "Connection structure for yarn wire and circuit board" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,739,980, issued on Sept. 15, was assigned to NEXTRONICS ENGINEERING CORP. (New Taipei City, Taiwan) and MAKALOT INDUSTRIAL Co. LTD. (Taipei City, Taiwan).

"Connection structure for yarn wire and circuit board" was invented by Hou-An Su (Keelung City, Taiwan) and Kuan-Wen Chen (New Taipei City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A connection structure includes at least one yarn wire, a back adhesive, and a circuit board. The yarn wire includes a yarn and a metal wire that are helically twisted. The back adhesive is elastic and is in an adhesive gel state when coming in contact with heat. A through hole is formed on the circuit board, ...