ALEXANDRIA, Va., March 3 -- United States Patent no. 12,568,587, issued on March 3, was assigned to NEXTRONICS ENGINEERING CORP. (New Taipei City, Taiwan) and MAKALOT INDUSTRIAL Co. LTD. (Taipei City, Taiwan).
"Connection method for yarn wire and circuit board" was invented by Hou-An Su (Keelung City, Taiwan) and Kuan-Wen Chen (New Taipei City, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A connection method for a yarn wire and a circuit board includes steps as follows: providing at least one yarn wire, a back adhesive, and a circuit board, at least one through hole is formed on the circuit board, and a diameter D of the through hole, a diameter d of the at least one yarn wire, a shrunken diameter d...