US Patent Issued to Nexperia on July 14 for "Film frame carrier for a curved wafer stage" (Dutch Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,088, issued on July 14, was assigned to Nexperia B.V. (Nijmegen, Netherlands).

"Film frame carrier for a curved wafer stage" was invented by Joep Stokkermans (Nijmegen, Netherlands), Gijs van der Veen (Nijmegen, Netherlands), Jasper Wesselingh (Nijmegen, Netherlands) and Patrick Houben (Nijmegen, Netherlands).

According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus for transferring a semiconductor die from an arrangement dies to a target is provided and relates to a wafer stage, and film frame carrier, and to an assembly including the film frame carrier and arrangement of dies. The wafer chuck includes a rotationally mounted curved shell on which ...