US Patent Issued to Nexperia on Dec. 30 for "Semiconductor device and a method of manufacturing a semiconductor device" (Dutch Inventors)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,512,450, issued on Dec. 30, was assigned to Nexperia B.V. (Nijmegen, Netherlands).

"Semiconductor device and a method of manufacturing a semiconductor device" was invented by On Lok Chau (Nijmegen, Netherlands), Fei Wong (Nijmegen, Netherlands), Martin Li (Nijmegen, Netherlands) and Hugo Wong (Nijmegen, Netherlands).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device is provided, including a first die, such as a GaN HEMT die, and a second die, such as a MOSFET die, with the second die positioned on the top of the first die. The second die is attached using a die attach adhesive. The semiconductor device further includes an encapsulant d...