ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,940, issued on Aug. 18, was assigned to Nexperia B.V. (Nijmegen, Netherlands).
"Power semiconductor device attached to a lead frame" was invented by Matthew Lloyd Anthony (Nijmegen, Netherlands), Ricardo Lagmay Yandoc (Nijmegen, Netherlands), Manoj Balakrishnan (Nijmegen, Netherlands) and Adam Richard Brown (Nijmegen, Netherlands).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device is provided that includes a lead frame, a die attached to the lead frame using a first solder, a clip attached to the die using a second solder, and a copper slug attached to the clip. First gull wing leads are attached to the leadframe for a drain connec...