US Patent Issued to NEWTECH on Aug. 4 for "Surface modification of solder paste stencils" (British, American Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,697,808, issued on Aug. 4, was assigned to NEWTECH LLC (Cincinnati).

"Surface modification of solder paste stencils" was invented by Steven Martin Johnson (Franklin, Ohio) and Fraser Murray Shaw (Troon, Great Britain).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to surface modification of solder paste stencils to provide improved adhesion of a functional coating. The disclosed surface modifications include laser structuring, plasma treatments, and primers. Methods of using the solder paste stencils are further disclosed."

The patent was filed on Feb. 27, 2021, under Application No. 17/802,291.

*For further information, i...