US Patent Issued to NEW-FAST TECHNOLOGY on July 14 for "Oven for wafers" (Taiwanese Inventor)

ALEXANDRIA, Va., July 14 -- United States Patent no. D1,133,702, issued on July 14, was assigned to NEW-FAST TECHNOLOGY Co. LTD. (Zhubei City, Taiwan).

"Oven for wafers" was invented by Tsung-Chih Huang (Zhubei City, Taiwan).

The patent was filed on Nov. 12, 2024, under Application No. D/972,754.

*For further information, including images, charts and tables, please visit: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=1&f=G&l=50&co1=AND&d=PTXT&s1=D1133702&OS=D1133702&RS=D1133702

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