US Patent Issued to Neuroloop on Sept. 2 for "Head part of an implantable device, method for producing the head part as well as a plug assembly which can be fitted into the head part" (German Inventors)

ALEXANDRIA, Va., Sept. 3 -- United States Patent no. 12,403,320, issued on Sept. 2, was assigned to Neuroloop GmbH (Freiburg, Germany).

"Head part of an implantable device, method for producing the head part as well as a plug assembly which can be fitted into the head part" was invented by Fabian Kimmig (Freiburg, Germany) and Tim Boretius (Freiburg, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "The invention is a head part of an implantable device, method of production thereof and a plug which can be fitted into the head part. The head part comprises a housing which has at least one blind hole plug contact socket with a socket opening as well as a socket base axially opposite the socket opening, al...