US Patent Issued to Netlist on June 2 for "Memory package having stacked array dies and reduced driver load" (California Inventor)

ALEXANDRIA, Va., June 2 -- United States Patent no. 12,646,537, issued on June 2, was assigned to Netlist Inc. (Irvine, Calif.).

"Memory package having stacked array dies and reduced driver load" was invented by Hyun Lee (Ladera Ranch, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A DRAM packages comprises stacked DRAM dies including first DRAM dies and second DRAM dies, first C/A interconnects and first data interconnects configured to conduct C/A signals and data signals to/from the first DRAM dies but not to/from any of the second DRAM dies, and second C/A interconnects and second data interconnects configured to conduct C/A signals and data signals to/from the second DRAM dies but not to/from any...