US Patent Issued to NEPES on Dec. 9 for "Semiconductor package including redistribution structure, and method of manufacturing the same" (South Korean Inventors)

ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,494,421, issued on Dec. 9, was assigned to NEPES Co. LTD. (Eumseong-gun, South Korea).

"Semiconductor package including redistribution structure, and method of manufacturing the same" was invented by Yong Tae Kwon (Eumseong, South Korea), Hyo Young Kim (Eumseong, South Korea), Eun Yeong Son (Eumseong, South Korea), Seung Ho Lee (Eumseong, South Korea), Kyeung Hwan Kim (Eumseong, South Korea) and Jong Hyun Park (Eumseong, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a semiconductor package including a redistribution structure including at least one redistribution insulating layer and at least one redistribution pattern, at least ...