ALEXANDRIA, Va., March 3 -- United States Patent no. 12,566,721, issued on March 3, was assigned to NEOWINE Co. Ltd. (Seongnam-si, South Korea).
"System semiconductor with multi project chip for protecting intellectual property right of the system semiconductor and the method thereof" was invented by Hyo Seung Lee (Seongnam-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A system semiconductor according to the present invention may include a common die including one or more components; and a special die having one or more components, wherein the common die may include a first chiplet that interfaces between one or more components provided in the common die and one or more components provided i...