ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,700,455, issued on Aug. 4, was assigned to NEO Semiconductor Inc. (San Jose, Calif.).
"3D cell and array structures" was invented by Fu-Chang Hsu (San Jose, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Various 3D cells, array structures, and processes are disclosed. In an embodiment, a 3D cell structure includes a NOR-type memory cell array having rows of memory cells, and each memory cell stores data that controls a cell current for that memory cell. The structure also includes bit lines connected to the rows of memory cells, and each bit line is connected to one memory cell in each of row. The cell structure also includes source lines connecte...