US Patent Issued to NEC Platforms on Sept. 8 for "Heat-dissipating waterproof structure" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,119, issued on Sept. 8, was assigned to NEC Platforms Ltd. (Kanagawa, Japan).

"Heat-dissipating waterproof structure" was invented by Takahiro Yagi (Kanagawa, Japan), Kiyotaka Yokoyama (Kanagawa, Japan), Akira Katsumata (Kanagawa, Japan) and Wataru Imura (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a heat-dissipating waterproof structure having both excellent heat dissipation ability and high waterproofness. A heat-dissipating waterproof structure (300) provided between a top part (203) of a casing (200) to accommodate a heat source (102) and the heat source (102) includes a water receiving part (301) that guides a liq...