US Patent Issued to NEC on May 12 for "Quantum device comprising first connection portions within deformation suppression region defined by second connection portions" (Japanese Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,572, issued on May 12, was assigned to NEC Corp. (Tokyo).

"Quantum device comprising first connection portions within deformation suppression region defined by second connection portions" was invented by Katsumi Kikuchi (Tokyo), Akira Miyata (Tokyo), Takanori Nishi (Tokyo), Kenji Nanba (Tokyo) and Ayami Yamaguchi (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A quantum device includes a chip including a superconducting circuit, a first wiring substrate, a second wiring substrate, first connection portions connecting the chip and a wiring layer on a first surface of the first wiring substrate and second connection portions connecting the second...