ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,564,049, issued on Feb. 24, was assigned to nD-HI Technologies Lab Inc. (Taipei, Taiwan).
"Diamond enhanced advanced ICs and advanced IC packages" was invented by Ho-Ming Tong (Taipei, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "This invention provides opportunity for diamond and bi-wafer microstructures to be implemented in advanced ICs and advanced IC packages to form a new breed of ICs and SiPs that go beyond the limitations of silicon at the forefront of IC advancement due primarily to diamond's extreme heat dissipating ability. Establishing the diamond and bi-wafer microstructure capabilities and implementing them in advanced ICs and adva...