US Patent Issued to ND-HI TECHNOLOGIES LAB, ETRON TECHNOLOGY on Sept. 29 for "Semiconductor package and semiconductor package assembly with edge side interconnection" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,308, issued on Sept. 29, was assigned to ND-HI TECHNOLOGIES LAB INC. and ETRON TECHNOLOGY INC. (Hsinchu, Taiwan).

"Semiconductor package and semiconductor package assembly with edge side interconnection" was invented by Ho-Ming Tong (Taipei City, Taiwan) and Chao-Chun Lu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a plurality of integrated circuit (IC) structures. Each IC structure includes: a first body having a primary surface and a secondary surface, wherein the primary surface is greater than the secondary surface in area; and a primary redistribution layer (RDL) over the primary surface of t...