US Patent Issued to ND-HI TECHNOLOGIES LAB, ETRON TECHNOLOGY on March 31 for "Manufacturing method of diamond composite wafer" (Taiwanese Inventors)

ALEXANDRIA, Va., March 31 -- United States Patent no. 12,593,688, issued on March 31, was assigned to ND-HI TECHNOLOGIES LAB INC. (Taipei City, Taiwan) and ETRON TECHNOLOGY INC. (Hsinchu, Taiwan).

"Manufacturing method of diamond composite wafer" was invented by Ho-Ming Tong (Taipei City, Taiwan), Wei Yen (Taipei City, Taiwan) and Chao-Chun Lu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method to form a first diamond composite wafer, a second diamond composite wafer or a third diamond composite wafer with a predetermined diameter includes the following steps: preparing a plurality of diamond blocks, wherein each diamond block has a dimension smaller than the predetermined diameter; atta...