US Patent Issued to NATIONAL TSING HUA UNIVERSITY on Sept. 29 for "Sensing system on chip and the manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,748,006, issued on Sept. 29, was assigned to NATIONAL TSING HUA UNIVERSITY (Hsinchu City, Taiwan).

"Sensing system on chip and the manufacturing method thereof" was invented by Tung-Lin Chien (Hsinchu, Taiwan), Ya-Chu Lee (Hsinchu, Taiwan) and Wei-Leun Fang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A sensing system on chip (SOC) is disclosed. The sensing system on chip (SOC) includes a substrate, a humidity sensing unit, an air pressure sensing unit and a gas sensing unit. The substrate has a plane. The humidity sensing unit is formed on the substrate. The air pressure sensing unit is formed on the substrate. The gas sensing unit ...