US Patent Issued to NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY on May 19 for "Flow molding woody material and flow molding material including same and woody molded body" (Japanese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,630,718, issued on May 19, was assigned to NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY (Chiyoda-ku, Japan).

"Flow molding woody material and flow molding material including same and woody molded body" was invented by Masako Seki (Nagoya, Japan), Mitsuru Abe (Nagoya, Japan) and Tsunehisa Miki (Nagoya, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A woody material, where a ratio (HB/HA) between a height (HA) of an absorption peak derived by C-H stretching vibration detected at a wavenumber from 2850 cm-1 to 2950 cm-1 and a height (HB) of an absorption peak derived by skeletal vibration of an aromatic ring detected at a wavenumbe...