US Patent Issued to NATIONAL INSTITUTE FOR MATERIALS SCIENCE on March 17 for "Polymer compound, method for producing polymer compound, adhesive composition, cured product, method for producing adhesive composition, and method for adjusting adhesion force" (Japanese Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,577,444, issued on March 17, was assigned to NATIONAL INSTITUTE FOR MATERIALS SCIENCE (Ibaraki, Japan).

"Polymer compound, method for producing polymer compound, adhesive composition, cured product, method for producing adhesive composition, and method for adjusting adhesion force" was invented by Masanobu Naito (Ibaraki, Japan) and Siqian Wang (Ibaraki, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a polymer compound having a repeating unit represented by Formula 1A below:wherein in Formula 1A, Z1 represents a hydrogen atom or a monovalent group, R1 represents a group represented by Formula 1B, L1 represents a divalent group, n repr...