ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,510,452, issued on Dec. 30, was assigned to Nanyang Technological University (Singapore).
"Modulus sensor" was invented by Zequn Cui (Singapore) and Xiaodong Chen (Singapore).
According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed is a device for measuring a property of a material. The device comprises a base; a sensor, the sensor being in a fixed coupling with the base; an indenter, the indenter being slidably coupled to the base to move relative to the base in an axial direction in response to a first abutment of the indenter with a surface of the material such that the indenter provides a push force to the sensor in the axial direction; and a locking...