US Patent Issued to NANYA TECHNOLOGY on Nov. 3 for "Package structure including inactive element, assembly structure and method of manufacturing the same" (Taiwanese Inventor)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,810, issued on Nov. 3, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan).

"Package structure including inactive element, assembly structure and method of manufacturing the same" was invented by Shing-Yih Shih (New Taipei City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure, an assembly structure and a manufacturing method are provided. The package structure includes at least one semiconductor device, at least one inactive element and an encapsulant. The at least one inactive element is disposed around the at least one semiconductor device, and includes a main portion and at least one through via extending thr...