US Patent Issued to NANYA TECHNOLOGY on Dec. 2 for "Package structure and method of forming thereof" (Taiwanese Inventor)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,489,023, issued on Dec. 2, was assigned to NANYA TECHNOLOGY Corp. (New Taipei, Taiwan).

"Package structure and method of forming thereof" was invented by Wu-Der Yang (Taoyuan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure includes a first substrate, a second substrate, a chip, a first wire and a second wire. The first substrate includes a top surface, a bottom surface, a window and a first conductive pad. The bottom surface of the first substrate is opposite to the top surface. The window communicates the top surface and the bottom surface. The first conductive pad is located over the bottom surface. The second substrate is lo...