ALEXANDRIA, Va., March 17 -- United States Patent no. 12,577,331, issued on March 17, was assigned to NAMICS Corp. (Niigata, Japan).
"Resin composition" was invented by Masayoshi Otomo (Niigata, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A resin composition suppresses unintended curing of a 2-methylene-1,3-dicarbonyl compound in the presence of conductive particles to facilitate the production of a paste including the 2-methylene-1,3-dicarbonyl compound for electronic components. The resin composition includes (a) at least one 2-methylene-1,3-dicarbonyl compound, (b) at least one type of conductive particles and (c) at least one monocarboxylic acid with a number of carbon atoms of 3 or more."
The ...