ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,414,225, issued on Sept. 9, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan).
"Circuit module" was invented by Yoshihito Otsubo (Nagaokakyo, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A first sealing resin is disposed between a first lower main surface and a second upper main surface. An upper circuit board first mounting electrode is disposed on the first lower main surface. A lower circuit board first mounting electrode is disposed on the second upper main surface. A first component is mounted on the lower circuit board first mounting electrode and is disposed in the first sealing resin. A first conductor layer is disposed on an...