ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,142, issued on Sept. 8, was assigned to MURATA MANUFACTURING Co. LTD. (Nagaokakyo, Japan).
"Shielded electronic component" was invented by Teppo Syrjanen (Helsinki).
According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic component comprising a package base and an at least partly metallic cap which is attached to the package base to form an enclosure. A metallic sheet is fixed to the package base. The metallic sheet comprises a sheet side section and the cap comprises a cap side section. The sheet side section is in contact with the cap side section so that they together form a side-shield on the side of the enclosure."
The patent was filed on J...