US Patent Issued to Murata Manufacturing on Nov. 3 for "High-frequency module including an electronic component disposed on a mounting board, where the electronic component directly contacts a ground electrode" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,176, issued on Nov. 3, was assigned to Murata Manufacturing Co. Ltd. (Kyoto, Japan).

"High-frequency module including an electronic component disposed on a mounting board, where the electronic component directly contacts a ground electrode" was invented by Takanori Uejima (Kyoto, Japan), Hiromichi Kitajima (Kyoto, Japan) and Dai Nakagawa (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A high-frequency module includes a mounting board, a first electronic component, a first resin layer, and a first ground electrode. The mounting board has a first principal surface and a second principal surface facing each other. The first electronic compo...