US Patent Issued to MURATA MANUFACTURING on May 26 for "Multilayer substrate" (Japanese Inventor)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,640,481, issued on May 26, was assigned to MURATA MANUFACTURING Co. LTD. (Nagaokakyo, Japan).

"Multilayer substrate" was invented by Kosuke Nishio (Nagaokakyo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "When viewed in a negative direction of a Z-axis, a radiation conductor layer region in which a radiation conductor layer is provided includes a ground conductor layer non-forming region in which one or more first ground conductor layers are not provided. When viewed in the negative direction of the Z-axis, a signal conductor layer includes an overlapping portion overlapping the ground conductor layer non-forming region. In the ground conductor l...