ALEXANDRIA, Va., June 16 -- United States Patent no. 12,308,161, issued on May 20, was assigned to MURATA MANUFACTURING Co. LTD. (Nagaokakyo, Japan).
"Module" was invented by Takahiro Kitazume (Nagaokakyo, Japan) and Daisuke Miyazaki (Nagaokakyo, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A module is provided with a substrate having a main surface, and each of one or more inductors that are disposed on the main surface of the substrate. A resin sealing portion seals the one or more inductors and covers the main surface of the substrate. A ground conductor is disposed on an outer peripheral side of the substrate with respect to entirety of the one or more inductors in a plan view. A plurality of lin...