US Patent Issued to MURATA MANUFACTURING on May 19 for "Acoustic wave device" (Japanese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,633,891, issued on May 19, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan).

"Acoustic wave device" was invented by Katsuya Daimon (Nagaokakyo, Japan) and Hideki Iwamoto (Nagaokakyo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An acoustic wave device includes a silicon substrate, a first high-acoustic-velocity film on the silicon substrate, a first low-acoustic-velocity film on the first high-acoustic-velocity film, a second low-acoustic-velocity film on the first low-acoustic-velocity film, a second high-acoustic-velocity film on the second low-acoustic-velocity film, a piezoelectric film on the second high-acoustic-velocity film, a...