ALEXANDRIA, Va., March 3 -- United States Patent no. 12,568,583, issued on March 3, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto-Fu, Japan).
"Circuit module" was invented by Yoshihito Otsubo (Nagaokakyo, Japan), Hideo Nakagoshi (Nagaokakyo, Japan) and Hiroki Yoshimori (Nagaokakyo, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "An upper circuit board body has a first upper main surface and a first lower main surface. A lower circuit board body has a second upper main surface and a second lower main surface. A lower circuit board first mounting electrode and one or more lower circuit board second mounting electrodes are disposed on the second upper main surface. A first component is mounted on th...